
12-Layer Low-Orbit Satellite Communication Equipment
rigid-pcbAvailability: In Stock
Product Description
Rigid PCBs for low-altitude flight applications typically feature high-Tg FR4, aluminum-based, or copper-based rigid substrates as their core materials. They are tailored for the key modules of low-altitude aerial vehicles—including flight controllers, power supplies, navigation systems, and image transmission units—across drones, agricultural sprayers, low-altitude inspection aircraft, and target drones. Their advantages perfectly address the core operational challenges of such equipment, such as high-frequency vibrations, wide temperature fluctuations, complex electromagnetic interference, and harsh outdoor environments.
Specifications
- ●Layer Count:12L
- ●Material:Megtron6
- ●Board Thickness:2.6mm
- ●Min.Trace/Space:5/4.8mil
- ●Surface Finish:ENIG
- ●Hybrid Lamination Material
- ●Back Drilling Process