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12-Layer Low-Orbit Satellite Communication Equipment

12-Layer Low-Orbit Satellite Communication Equipment

rigid-pcbAvailability: In Stock

Product Description

Rigid PCBs for low-altitude flight applications typically feature high-Tg FR4, aluminum-based, or copper-based rigid substrates as their core materials. They are tailored for the key modules of low-altitude aerial vehicles—including flight controllers, power supplies, navigation systems, and image transmission units—across drones, agricultural sprayers, low-altitude inspection aircraft, and target drones. Their advantages perfectly address the core operational challenges of such equipment, such as high-frequency vibrations, wide temperature fluctuations, complex electromagnetic interference, and harsh outdoor environments.

Specifications

  • Layer Count:12L
  • Material:Megtron6
  • Board Thickness:2.6mm
  • Min.Trace/Space:5/4.8mil
  • Surface Finish:ENIG
  • Hybrid Lamination Material
  • Back Drilling Process

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