4-Layer RF Narrow-Pitch Packaging Substrate

Product Description

RF substrate refers to Radio Frequency package substrate, an advanced packaging substrate specially designed to carry RF chips and passive components, ensure low-loss transmission and impedance matching of high-frequency signals (typically ranging from 100MHz to 100GHz). It is widely used in high-frequency system packaging scenarios such as SiP Radio Frequency Front-End Modules (RFFEM), power amplifiers, filters and RF switches, serving as a core carrier for connecting chips and systems and enabling efficient interconnection of RF signals.