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Substrate-like-PCB (SLP)
Substrate-Like PCB (SLP) : A new-type interconnection carrier that achieves ultra-high-density wiring on traditional PCB substrates by integrating PCB manufacturing processes with the fine circuit technology of IC substrates. It represents a high-end advanced form of HDI technology rather than an entirely new technical route independent of PCBs.

Dual-sided Embedded Multi-chip Package Substrate
Layer Count:2L
Material:HL832NXA
Board Thickness:0.11mm
Min.Trace/Space:1.18/2mil
Surface Finsh:ENEPIG
Copper paste plugging process
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Double-Sided NiPdAu Impedance-Controlled Substrate
Layer Count:2L
Material:SI10U
Board Thickness:0.23mm
Min.Trace/Space:30/30um
Surface Finsh:ENEPIG
Copper paste plugging process
Support Impedance
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